Nonsilicon micromachining for MOEMS elements

Yi-Xin Chen; Xiaolin Zhao; Zongguang Wang

doi:10.1117/12.302403

15 March 1998 Nonsilicon micromachining for MOEMS elements

Yi-Xin Chen, Xiaolin Zhao, Zongguang Wang

Proceedings Volume 3276, Miniaturized Systems with Micro-Optics and Micromechanics III; (1998) https://doi.org/10.1117/12.302403
Event: Optoelectronics and High-Power Lasers and Applications, 1998, San Jose, CA, United States

Abstract

For many MEMS devices, silicon including polysilicon so far is the most idea materials, therefore the silicon micromachining technology has been well developed. However, for some MOEMS devices and systems, using other materials such as glasses, quartz, dielectric and ferroelectric crystals or ceramics, compound semiconductors, metals and alloys are also available or unique. As a result, it is necessary to develop the nonsilicon micromachining technology. In this paper, the nonsilicon micromachining process and some devices such as different kinds of micro- hinges will be reported.

Citation Download Citation

Yi-Xin Chen, Xiaolin Zhao, and Zongguang Wang "Nonsilicon micromachining for MOEMS elements", Proc. SPIE 3276, Miniaturized Systems with Micro-Optics and Micromechanics III, (15 March 1998); https://doi.org/10.1117/12.302403

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