Paper
19 November 1998 Residual stresses in Mo/Si and Mo2C/Si multilayers
Tai D. Nguyen, Troy W. Barbee Jr.
Author Affiliations +
Abstract
We report a study of the residual stresses and residual stress relaxation in Mo/Si and Mo2C/Si EUV multilayers. The multilayers were fabricated by magnetron sputter deposition, and stress measured using the substrate curvature laser scanning technique. It was found that Mo2C/Si multilayers exhibit higher compressive stress than Mo/Si of comparable period and layer thickness ratio. The multilayers sputtered at 0.5 mT Ar pressure have higher compressive stress than those sputtered at 2 mT Ar pressure. The data indicate that the residual stresses in the multilayers are primarily determined by the Si layers. Annealing of the multilayers at a heating rate of 5 degrees C/minute as well as at a fixed temperature results in a reduction of the compressive stresses. Near zero stress is achieved after annealing at 300 degrees C. The time dependence of the residual stress decrease during isothermal annealing was found to fit best to a bimolecular viscous flow model of defect annihilation in the amorphous Si layers. The relationships between the effects of annealing on the multilayer microstructure and the observed stress reduction are discussed.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tai D. Nguyen and Troy W. Barbee Jr. "Residual stresses in Mo/Si and Mo2C/Si multilayers", Proc. SPIE 3444, X-Ray Optics, Instruments, and Missions, (19 November 1998); https://doi.org/10.1117/12.331274
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Cited by 3 scholarly publications.
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KEYWORDS
Multilayers

Silicon

Annealing

Molybdenum

Argon

Sputter deposition

Data modeling

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