Paper
20 September 1999 High-aspect-ratio microdrilling in polymeric materials with intense KrF laser radiation
John Lopez, Sylvain Lazare, Francois Weisbuch
Author Affiliations +
Proceedings Volume 3822, Computer-Controlled Microshaping; (1999) https://doi.org/10.1117/12.364214
Event: Industrial Lasers and Inspection (EUROPTO Series), 1999, Munich, Germany
Abstract
UV laser microdrilling of high aspect ratio holes requires a low numerical aperture and intense beam. It does not produce any thermal or mechanical damage on the target. In some particular experimental conditions, it is shown that long deep holes are obtained with reproducible aspect ratio ((Phi) /d approximately equals 600) in a variety of materials. Generally speaking the more absorbing the polymer is, the better is the resolution. However highly absorbing materials exhibit a low ablation rate. These promising results on laser microdrilling can be extended to new applications when beam and target relative movement is computer driven. For instance this approach can applied to cutting micro-objects with complicated shape or machining of fragile or brittle materials.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John Lopez, Sylvain Lazare, and Francois Weisbuch "High-aspect-ratio microdrilling in polymeric materials with intense KrF laser radiation", Proc. SPIE 3822, Computer-Controlled Microshaping, (20 September 1999); https://doi.org/10.1117/12.364214
Lens.org Logo
CITATIONS
Cited by 3 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Polymers

Laser ablation

Polymethylmethacrylate

Excimer lasers

Positron emission tomography

Ultraviolet radiation

Laser drilling

Back to Top