Paper
8 October 1999 Modeling of electrohydrodynamically enhanced pool boiling heat transfer using helical coil electrodes
Thai H. Nguyen, Jafar Madadnia
Author Affiliations +
Proceedings Volume 3893, Design, Characterization, and Packaging for MEMS and Microelectronics; (1999) https://doi.org/10.1117/12.368462
Event: Asia Pacific Symposium on Microelectronics and MEMS, 1999, Gold Coast, Australia
Abstract
Electrohydrodynamic (EHD) enhancement of pool boiling may improve heat-sinks used in micro-electronic devices. The effect depends on the applied electrode voltage. Mathematical models for the heat transfer coefficient with refrigerant R11 for boiling in both free convection and nucleate regions are developed from experimental results. The results show that heat removal is enhanced by 250 percent in the free convection region, and by a lesser amount in the nucleate region.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Thai H. Nguyen and Jafar Madadnia "Modeling of electrohydrodynamically enhanced pool boiling heat transfer using helical coil electrodes", Proc. SPIE 3893, Design, Characterization, and Packaging for MEMS and Microelectronics, (8 October 1999); https://doi.org/10.1117/12.368462
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KEYWORDS
Electrodes

Convection

Heat flux

Mathematical modeling

Power supplies

Liquids

Copper

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