Laser droplet weld: an innovative joining technology opens new application possibilities

Bernd Jahrsdoerfer; Gerd Esser; Manfred Geiger; Edvard Govekar

doi:10.1117/12.479576

17 October 2003 Laser droplet weld: an innovative joining technology opens new application possibilities

Bernd Jahrsdoerfer, Gerd Esser, Manfred Geiger, Edvard Govekar

Proceedings Volume 4977, Photon Processing in Microelectronics and Photonics II; (2003) https://doi.org/10.1117/12.479576
Event: High-Power Lasers and Applications, 2003, San Jose, CA, United States

Abstract

"Laser Droplet Welding" is an innovative joining technology. The welding is realised by a laser generated liquid metal droplet which is deposited onto the parts to be joined. The raw material is a metal wire. In conventional laser welding a gap between the parts worsens the quality of the laser welded joint substantially. Contrarily a droplet offers sufficient material to bridge gaps. Even different gap sizes can be bridged by a suitable selection of the droplet size. A further advantage is the controllable heat transfer, only given by the heat content of a single drop that is sufficient to produce a high-temperature weld. The droplet heating provides the opportunity to weld small devices, thin coatings and even heat sensitive components without negative influence on their mechanical and electrical function. It is also possible to interconnect different materials by the addition of material supplied in form of drops. With the Laser Droplet Weld it is furthermore possible to join high reflective materials. This article describes the process and the system technology as well as achieved results. It will mainly focus on the droplet detachment which influences the complete process, e.g. the heat quantity or weld splashes.

Citation Download Citation

Bernd Jahrsdoerfer, Gerd Esser, Manfred Geiger, and Edvard Govekar "Laser droplet weld: an innovative joining technology opens new application possibilities", Proc. SPIE 4977, Photon Processing in Microelectronics and Photonics II, (17 October 2003); https://doi.org/10.1117/12.479576

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