Debris-free EUV source using a through-hole tin target

Yoshifumi Ueno; Tatsuya Aota; Gohta Niimi; Dong-Hoon Lee; Kentaro Nishigori; Hidehiko Yashiro; Toshihisa Tomie

doi:10.1117/12.483746

16 June 2003 Debris-free EUV source using a through-hole tin target

Yoshifumi Ueno, Tatsuya Aota, Gohta Niimi, Dong-Hoon Lee, Kentaro Nishigori, Hidehiko Yashiro, Toshihisa Tomie

Proceedings Volume 5037, Emerging Lithographic Technologies VII; (2003) https://doi.org/10.1117/12.483746
Event: Microlithography 2003, 2003, Santa Clara, California, United States

Abstract

Laser plasma light source using double pulses laser irradiation and through-hole method is proposed as a mass-limited target srouce for extreme UV (EUV) radiation. After minimum necessary material is supplied using the ablation laser from a solid target, only ablated material is irradiated with the heating laser to produce a high-temperature plasma, and EUV radiation is extracted passing through the hole formed in the solid target. Fundamental concept of this scheme, EUV radiation and great reduction of particle debris were experimentally confirmed.

Citation Download Citation

Yoshifumi Ueno, Tatsuya Aota, Gohta Niimi, Dong-Hoon Lee, Kentaro Nishigori, Hidehiko Yashiro, and Toshihisa Tomie "Debris-free EUV source using a through-hole tin target", Proc. SPIE 5037, Emerging Lithographic Technologies VII, (16 June 2003); https://doi.org/10.1117/12.483746

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