Paper
28 May 2003 Use of nanomachining for 100-nanometer mask repair
Author Affiliations +
Proceedings Volume 5148, 19th European Conference on Mask Technology for Integrated Circuits and Microcomponents; (2003) https://doi.org/10.1117/12.515088
Event: 19th European Conference on Mask Technology for Integrated Circuits and Microcomponents, 2003, Sonthofen, Germany
Abstract
Nanomachining has recently been introduced as a new technology for subtractive repair of 130-nanometer masks. The RAVE LLC nml 300 utilizes this innovative strategy, facilitating repairs of all materials currently used in mask production. This technology has allowed 130- nanometer mask repair specifications to be met. This paper introduces nanomachining as a method of repairing next generation 100-nanometer masks. Emphasis will be given to materials and designs that provide significant challenges to current industry repair techniques; specifically quartz bumps on alternating phase shift masks and repairs within tight lines and spaces. Several advantages will be demonstrated, including the ability to machine within high aspect ratio features, the capability to duplicate edge slope, superior edge placement control, quartz bump repair, and transmission values approaching defect-free areas. This paper will compare performance to the SIA roadmap requirements for 100-nanometer mask repair using RAVE LLC' S next generation system, the nm1000.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Bob T. LoBianco, Roy White, and Ted Nawrocki "Use of nanomachining for 100-nanometer mask repair", Proc. SPIE 5148, 19th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (28 May 2003); https://doi.org/10.1117/12.515088
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KEYWORDS
Photomasks

Quartz

Image processing

Phase shifts

Atomic force microscopy

Binary data

Cryogenics

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