Paper
8 October 2004 Micro-machining of silicon and glass with picosecond lasers
Gediminas Raciukaitis, Marijus Brikas
Author Affiliations +
Proceedings Volume 5662, Fifth International Symposium on Laser Precision Microfabrication; (2004) https://doi.org/10.1117/12.596604
Event: Fifth International Symposium on Laser Precision Microfabrication, 2004, Nara, Japan
Abstract
Results of microdrilling and cutting in silicon and glass with picosecond lasers are presented. Recent progress in the development of diode-pumped mode-locked (picosecond) lasers has increased interest in their industrial application, especially in microfabrication. Our experiments started from single-shot patterning and extended to cutting and drilling of complex shapes. They are directed at finding the right niche for these lasers. All-solid-state Nd-doped lasers of PL2200 series with high peak power were used. Pulse duration of 60 ps and pulse energy up to several mJ at 1 kHz repetition rate allowed to cover a wide energy density range above ablation threshold for processing. Limitations of processing windows for laser fabrication with picosecond pulses were established. The results are a consistent step in search of optimal regimes for crack-free processing with minimal deposit of material and high quality of ablated surface.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gediminas Raciukaitis and Marijus Brikas "Micro-machining of silicon and glass with picosecond lasers", Proc. SPIE 5662, Fifth International Symposium on Laser Precision Microfabrication, (8 October 2004); https://doi.org/10.1117/12.596604
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Cited by 10 scholarly publications.
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KEYWORDS
Picosecond phenomena

Silicon

Glasses

Laser ablation

Laser cutting

Semiconductor lasers

Semiconducting wafers

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