Paper
23 January 2006 Combined low-coherence interferometry and spectrally resolved reflectometry for nondestructive characterization of small-diameter high-aspect ratio micro-fabricated and micro-machined structures and multilayer membranes
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Abstract
We propose novel tool employing both low coherence interferometer and spectrally resolved reflectometer sensor. We discuss application of this novel tool for measurements of the narrow high aspect ratio structures. We demonstrate that the visible reflectance spectrum of such structures allows us to extend range of interferometer to measure depth trenches with diameter from 2 μm to 1 mm, with reproducibility 10 nm - 100 nm depending on range of the thin film thickness. We also present of this novel tool for measurement of ultra-thin coated pressure sensor membranes. Application of an auxiliary spectral reflectometer allows correcting for systematic errors of low coherence interferometer which can be as large as 1.5 - 2 μm.
© (2006) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wojciech J. Walecki, Talal Azfar, Alexander Pravdivstev, Manuel Santos II, and Ann Koo "Combined low-coherence interferometry and spectrally resolved reflectometry for nondestructive characterization of small-diameter high-aspect ratio micro-fabricated and micro-machined structures and multilayer membranes", Proc. SPIE 6109, Micromachining and Microfabrication Process Technology XI, 61090J (23 January 2006); https://doi.org/10.1117/12.639267
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KEYWORDS
Interferometers

Reflectometry

Semiconducting wafers

Sensors

Silicon

Interferometry

Reflectivity

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