White light spectral interferometric technique used to measure thickness of thin films

P. Hlubina; D. Ciprian; R. Clebus; J. Luňáček; M. Lesňák

doi:10.1117/12.724619

18 June 2007 White-light spectral interferometric technique used to measure thickness of thin films

P. Hlubina, D. Ciprian, R. Clebus, J. Luňáček, M. Lesňák

Proceedings Volume 6616, Optical Measurement Systems for Industrial Inspection V; 661605 (2007) https://doi.org/10.1117/12.724619
Event: Optical Metrology, 2007, Munich, Germany

Abstract

We present a white-light spectral interferometric technique for measuring the thickness of a thin film on a substrate. First, the channeled spectrum is expressed analytically for a setup of a slightly dispersive Michelson interferometer with a cube beam splitter of given effective thickness and a fiber-optic spectrometer of a Gaussian response function when one of the interferometer mirrors is replaced by the thin film on the substrate. Then we model the wavelength dependences of the reflectance, the visibility of the spectral interference fringes, the phase change on reflection and the so-called nonlinear phase function, respectively, for a SiO₂ thin film on a silicon wafer. In the modeling, the optical constants are known and multiple reflection within the thin-film structure is taken into account. Second, we perform interferometric experiments with a SiO thin film on aluminium and the SiO₂ thin film on the silicon wafer. Channeled spectra are recorded for determining the thin-film thickness, provided that the optical constants of the thin-film structure are known. We confirm very good agreement between theoretical and experimental channeled spectra and determine precisely the thicknesses for two cases including the SiO thin film on the aluminium and the SiO₂ thin film on the silicon wafer.

Citation Download Citation

P. Hlubina, D. Ciprian, R. Clebus, J. Luňáček, and M. Lesňák "White-light spectral interferometric technique used to measure thickness of thin films", Proc. SPIE 6616, Optical Measurement Systems for Industrial Inspection V, 661605 (18 June 2007); https://doi.org/10.1117/12.724619

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available