Micro-optics soldering on multifunctional system platforms

Erik Beckert; Henrik Banse; Ramona Eberhardt; Andreas Tünnermann

doi:10.1117/12.667992

21 April 2006 Micro-optics soldering on multifunctional system platforms

Erik Beckert, Henrik Banse, Ramona Eberhardt, Andreas Tünnermann

Proceedings Volume 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration; 618509 (2006) https://doi.org/10.1117/12.667992
Event: SPIE Photonics Europe, 2006, Strasbourg, France

Abstract

Laser beam soldering as a longterm and temperature stable joining alternative to adhesive bonding for optoelectronical systems is introduced. Using a solder alloy that can be processed fluxless (e.g. 80Au20Sn) more functionality than pure position securing, for instance electrical connections and heat sinks for laseroptics, can be incorporated into the joint. Along with smart system platforms, made from ceramics and composites, providing the right interfaces for such functional joints a dense integration of optical and heat generating electrooptical components becomes possible.

Citation Download Citation

Erik Beckert, Henrik Banse, Ramona Eberhardt, and Andreas Tünnermann "Micro-optics soldering on multifunctional system platforms", Proc. SPIE 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, 618509 (21 April 2006); https://doi.org/10.1117/12.667992

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