Process analysis of diamond ablation by 157nm laser

Weilai Li; Desheng Jiang; Yutang Dai; Miao Gao

doi:10.1117/12.757663

4 January 2008 Process analysis of diamond ablation by 157nm laser

Weilai Li, Desheng Jiang, Yutang Dai, Miao Gao

Proceedings Volume 6825, Lasers in Material Processing and Manufacturing III; 68251B (2008) https://doi.org/10.1117/12.757663
Event: Photonics Asia 2007, 2007, Beijing, China

Abstract

The experiment of micro-ablating diamonds, natural diamond and HTHP manmade diamond, has demonstrated that F₂ 157nm laser can break the chemical bonds of hard material with low laser pulse power, and ionizes them rapidly. The ablation thresholds of these two kind of diamonds were tested as 2.0J/cm² and 3.0J/cm² respectively. Stair ablation on the polished surface of the natural diamond showed that a pulse could ablate 17nm depth on a 25μm×25μm square, however, for the polished surface of HTHP diamond, the depth was 12nm. The edges of ablating square were sharp, few spatters were observed, and 3-D ablation quality was good. The thermal calculation shows that the temperature rise was not very seriously. The interaction and the mechanism of ablative photo decomposition between the photons of 157nm laser and the atoms of diamond are presented. Diamond is a covalent crystal. Covalent bonds associate carbon atoms. The cohesive energy of diamond is 7.36eV, and its binding energy is 3.68eV. Comparing with 7.9eV of 157nm photon energy, it can be inferred that the mechanism of interactions between 157nm laser and diamond is a process of single-photon absorption.

Citation Download Citation

Weilai Li, Desheng Jiang, Yutang Dai, and Miao Gao "Process analysis of diamond ablation by 157nm laser", Proc. SPIE 6825, Lasers in Material Processing and Manufacturing III, 68251B (4 January 2008); https://doi.org/10.1117/12.757663

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