Paper
17 October 2008 Results from the KLA-Tencor TeraScanXR reticle inspection tool
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Abstract
The new TeraScanXR reticle inspection system extends the capability of the previous TeraScanHR platform to advanced 32nm logic and 40nm Half Pitch (HP) memory technology nodes. The TeraScanXR has been designed to provide a significant improvement in image quality, defect sensitivity and throughput relative to the HR platform. Defect sensitivity is increased via a combination of improved Die-to-Die (D:D) and Die-to-Database (D:DB) algorithms, as well as enhancements to the image auto-focus (IAF). Modifications to system optics and the introduction of a more powerful image processing computer have enabled a ~2X faster inspection mode. In this paper, we describe the key features of the TeraScanXR platform and present preliminary data that illustrate the capability of this tool. TeraScanHR tools currently at customer sites are field-upgradeable to the TeraScanXR configuration.
© (2008) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Aditya Dayal, Bo Mu, Venkat Iyer, Phillip Lim, Arosha Goonesekera, and Bill Broadbent "Results from the KLA-Tencor TeraScanXR reticle inspection tool", Proc. SPIE 7122, Photomask Technology 2008, 71223G (17 October 2008); https://doi.org/10.1117/12.801831
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Cited by 3 scholarly publications.
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KEYWORDS
Inspection

Reticles

Line edge roughness

Sensors

Signal to noise ratio

Detection and tracking algorithms

Modulation transfer functions

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