Through-wafer interconnects for high degree of freedom MEMS deformable mirrors

Alioune Diouf; Thomas G. Bifano; Jason B. Stewart; Steven Cornelissen; Paul Bierden

doi:10.1117/12.842341

18 February 2010 Through-wafer interconnects for high degree of freedom MEMS deformable mirrors

Alioune Diouf, Thomas G. Bifano, Jason B. Stewart, Steven Cornelissen, Paul Bierden

Proceedings Volume 7595, MEMS Adaptive Optics IV; 75950N (2010) https://doi.org/10.1117/12.842341
Event: SPIE MOEMS-MEMS, 2010, San Francisco, California, United States

Abstract

The development of an assembly and packaging process for MEMS deformable mirrors (DMs) with through wafer via (TWV) interconnects is presented. The approach consists of attaching a DM die with high-density TWV electrostatic actuator interconnects to an interposer substrate that fans out these connections for interfacing to conventional packaging technology.

Citation Download Citation

Alioune Diouf, Thomas G. Bifano, Jason B. Stewart, Steven Cornelissen, and Paul Bierden "Through-wafer interconnects for high degree of freedom MEMS deformable mirrors", Proc. SPIE 7595, MEMS Adaptive Optics IV, 75950N (18 February 2010); https://doi.org/10.1117/12.842341

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