Grinding tool optimization in computer controlled grinding of SiC aspheric mirror

Ci Song; Yi Lu; Yanglin Peng

doi:10.1117/12.2073165

18 November 2014 Grinding tool optimization in computer controlled grinding of SiC aspheric mirror

Ci Song, Yi Lu, Yanglin Peng

Proceedings Volume 9298, International Symposium on Optoelectronic Technology and Application 2014: Imaging Spectroscopy; and Telescopes and Large Optics; 92981T (2014) https://doi.org/10.1117/12.2073165
Event: International Symposium on Optoelectronic Technology and Application 2014, 2014, Beijing, China

Abstract

The shape, size and material of grinding tool not only affect the machining accuracy, but also the machining efficiency in the process of Computer Controlled Grinding. The hardness of the SiC aspheric mirror, the misfit of grinding tool and the work-piece also emphasize the importance of grinding tool optimization. By means of analyzing the misfit property of grinding tool and aspheric optic theoretically, as well as the wear character and the process of the grinding tool experimentally, this manuscript establishes the rule of grinding tool optimization satisfying different machining objective. Based on this, the adopted grinding tool was optimized in the grinding process of SiC off-axis aspheric (634mm×560mm). The simulation provide reasonable grinding tool for the off-axis aspheric grinding, and good results (large amount material removal and edge error figuring) are obtained when the optimized grinding tool are applied. Both of the simulations and experiments demonstrate the feasibility and correctness of the grinding tool optimization method.

Citation Download Citation

Ci Song, Yi Lu, and Yanglin Peng "Grinding tool optimization in computer controlled grinding of SiC aspheric mirror", Proc. SPIE 9298, International Symposium on Optoelectronic Technology and Application 2014: Imaging Spectroscopy; and Telescopes and Large Optics, 92981T (18 November 2014); https://doi.org/10.1117/12.2073165

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