Paper
28 August 2016 Applications of model-based transparent surface films analysis using coherence scanning interferometry
Martin F. Fay, Thomas Dresel
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Abstract
Surface metrology must increasingly contend with sub-micron films, whose prevalence now extends to products well beyond semiconductor devices. For optical technologies such as coherence-scanning interferometry (CSI), transparent sub-micron films pose a dual challenge: film effects can distort the measured top surface topography map, and metrology requirements may now include 3D maps of film thickness. Yet CSI’s sensitivity also presents an opportunity: modeling film effects can decode surface and thickness from the distorted signal. Early model-based approaches entailed practical trade-offs between throughput and field of view, and restricted the choice of objective magnification. However, more recent advances allow full-field surface films analysis using any objective, with sample-agnostic calibration and throughput comparable to film-free measurements. Beyond transparent films, model-based CSI provides correct topography for any combination of dissimilar materials with known visible-spectrum refractive indices. Results demonstrate single-nm self-consistency between topography and thickness maps.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Martin F. Fay and Thomas Dresel "Applications of model-based transparent surface films analysis using coherence scanning interferometry", Proc. SPIE 9960, Interferometry XVIII, 996005 (28 August 2016); https://doi.org/10.1117/12.2238997
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Cited by 4 scholarly publications.
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KEYWORDS
Oxides

Model-based design

Silicon

Calibration

Gold

Metrology

Interferometry

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