Poster
5 March 2022 Development of high-power normally-off p-GaN gate AlGaN/GaN high-electron mobility transistors
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Conference Poster
Abstract
Normally-off AlGaN/GaN HEMTs with p-GaN-gate, which offer high drain current and low on-state resistance at high threshold voltage and breakdown voltage values above 600V, are particularly attractive for high-power electronics applications. In this work we present the results of development of high power normally-off p-GaN gate AlGaN/GaN high electron mobility transistors carried out at Łukasiewicz Research Network-Institute of Microelectronics and Photonics. We have developed key technological steps i.e. selective etching of p-GaN layers over AlGaN, deposition of proper passivation layer as well as thermally stable isolation of adjacent devices using selective Fe+ ion implantation, which were integrated in the process flow of manufacturing of high power transistors. Finally we have shown measurements of developed normally-off p-GaN gate AlGaN/GaN HEMT power transistors assembled using in-house developed process in TO-220 package.
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Anna Szerling, Andrzej Taube, Maciej Kaminski, Marek Ekielski, Jarosław Tarenko, Karolina Pągowska, Maciej Kozubal, Kamil Kosiel, Renata Kruszka, Krystyna Golaszewska-Malec, Ernest Brzozowski, Norbert Kwietniewski, and Ryszard Kisiel "Development of high-power normally-off p-GaN gate AlGaN/GaN high-electron mobility transistors", Proc. SPIE PC12001, Gallium Nitride Materials and Devices XVII, PC120011L (5 March 2022); https://doi.org/10.1117/12.2611724
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KEYWORDS
Transistors

Field effect transistors

Gallium nitride

Iron

Etching

Electronics

Resistance

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