A core engine to enable high quality multi-beam mask writers for 2nm node and beyond

Patrick P. W. Lee; Frankie F. G. Tsai; Harry C. Y. Ku; Min-Da Cheng; Joey J. Y. Wang; Peter J. Y. Chang; M. J. Lii; Jacqueline Atanelov; Anh-Dai Dang; Samuel Kvasnica

doi:10.1117/12.2688300

4 December 2023 A core engine to enable high quality multi-beam mask writers for 2nm node and beyond

Patrick P. W. Lee, Frankie F. G. Tsai, Harry C. Y. Ku, Min-Da Cheng, Joey J. Y. Wang, Peter J. Y. Chang, M. J. Lii, Jacqueline Atanelov, Anh-Dai Dang, Samuel Kvasnica

Author Affiliations +

Proceedings Volume PC12751, Photomask Technology 2023; PC127510S (2023) https://doi.org/10.1117/12.2688300
Event: SPIE Photomask Technology + EUV Lithography, 2023, Monterey, California, United States

Abstract

High numerical aperture extreme ultraviolet (High NA EUV) lithography and the support of computational lithography are enabling the race towards smaller nodes. An important tool empowering this trend is the multi-beam mask writer (MBMW). Its most prominent feature is the so-called BLC (blanking-chip): a MEMS processed CMOS chip determining writing speed and precision. This paper describes the innovative MEMS process on the post processing of such a BLC. Key features of the blanking-chip are its 590k apertures and electrode pairs within an area of <15x15mm^2. The strict requirement on performance and cleanness of the chip on the comparably large area makes the MEMS process challenging. Intensive analysis and MEMS process tuning made it possible to complete the first fully processed 590k-BLCs with >99.5% of all apertures and electrodes being clean and defect free. Additionally, other crucial parameters such as blanking angle and crosstalk have met the required specification. The 590k-BLC was qualified in the first prototype next generation MBMW-301 ALPHA. Comparing it to the latest MBMW-201 generation, optical performance as image plane curvature and aberration blur of the beams are decreased by 31% and 41%, respectively. These results indicate the upcoming potential of the 590k-BLC within the MBMW-301 enabling highly improved spatial resolution and pattern fidelity.

Conference Presentation

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Patrick P. W. Lee, Frankie F. G. Tsai, Harry C. Y. Ku, Min-Da Cheng, Joey J. Y. Wang, Peter J. Y. Chang, M. J. Lii, Jacqueline Atanelov, Anh-Dai Dang, and Samuel Kvasnica "A core engine to enable high quality multi-beam mask writers for 2nm node and beyond", Proc. SPIE PC12751, Photomask Technology 2023, PC127510S (4 December 2023); https://doi.org/10.1117/12.2688300

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