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30 November 2023 Next generation polishing consumables for silicon and polysilicon to achieve very low surface roughness with high throughput
Floyd McClung
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Proceedings Volume PC12778, Optifab 2023; PC1277808 (2023) https://doi.org/10.1117/12.2692020
Event: SPIE Optifab, 2023, Rochester, New York, United States
Abstract
Many advanced applications require high throughput, high removal rate processing of silicon and polysilicon materials with very low surface roughness. This presentation will focus on the latest consumable sets for processing silicon and polysilicon to achieve high removal rate and very low surface roughness. We will present the polishing results using double sided polishing tools from different consumables showing the effects of changing slurries, pads and cleaning chemistry on polishing results. This presentation present data on current generation and next generation consumables to show how the optimization of new slurries and pads can achieve high removal rate and very low surface roughness.
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Floyd McClung "Next generation polishing consumables for silicon and polysilicon to achieve very low surface roughness with high throughput", Proc. SPIE PC12778, Optifab 2023, PC1277808 (30 November 2023); https://doi.org/10.1117/12.2692020
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KEYWORDS
Polishing
Silicon
Surface roughness
Particles
Chemistry
Data analysis
Diamond
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