We report femtosecond laser cutting of ultrathin ferroelectric sheets. This process enables one to do rapid patterning
of microns-thick films of complex oxides such as LiNbO3, which are obtained via ion-beam exfoliation from
standard wafers. Cutting these fragile samples is extremely difficult using standard methods but can be done
effectively with ultrafast lasers. To achieve fast writing speed, we employ a high-repetition-rate amplified
Ti:sapphire laser system with a pulse peak power of ~100MW. Optimization of the depth and quality of cut were
determined as a function of laser pulse energy, crystallographic axes, optical polarization, and pre- and post-ablation
chemical treatments.
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