For additive manufacturing, scanning systems based on diode lasers offer unique advantages over conventionally used solid state lasers. Their fast modulation and high beam quality allow the production of precise polymer parts. However, the material portfolio which conventionally can be used on such stereolithography (SLA) systems is limited to resins which can be processed at room temperature. By controlled heating of a thinly coated material film (Hot Lithography), the available process window is significantly expanded. We present photopolymers with safe fire behavior of walls as thin as 0.45 mm. Using the precision of diode lasers without sacrificing fabrication speed, these materials are particularly suitable for the production of connectors for electronics industry.
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