Freeform Laser cutting for glass sheets, based on the Corning® nanoPerforation process, is a well-established process in multiple industrial applications, in the consumer electronics, automotive and semiconductor industry. Ultrashort pulsed lasers offer the possibility for a very confined energy deposition using non-diffractive beams, resulting in laser cuts with exceptional performance at high process speeds. Further benefits include an optimized material utilization for this clean, energy efficient and waste free technology. The fundamental understanding of the interdependencies of various laser process parameter and glass composition by relying on accessible glass properties, like CTE (coefficient of thermal expansion) or hardness, is the key to optimize the laser cutting results. This Knowledge enables fast process development, resulting in highest quality in sub-surface damage, edge strength and chipping distribution. Design of Experiments (DOE) is an efficient method to reveal the underlying correlation for this very specific non-linear laser material interaction. As the CTQ’s are not independent from each other, a DOE based approach systematically describes the interaction. The resulting advantage is a high process stability and yield which consequently facilitates a robust solution for industrial implementation. The machine- and laser configuration based on this know-how allows to cut a wide range of glass compositions and thickness by manipulating software-based recipes rather than by time- and cost-intensive reconfiguration of the optical setup.
The use of glass wafers for optical and electronic device substrates requires a high-quality, high throughput dicing solution. The patented Corning® laser nanoPerforation process is well-established in multiple industrial applications for glass cutting. A key attribute is the homogeneous appearance of the side wall over the full thickness of the glass and its high edge quality with low chipping and high throughput performance. Combining this laser-based solution with the mechanical breaking technology by Dynatex provides a complete and scalable path for glass wafer dicing applicable to normal, as well as very small die sizes. Detailed investigations on several different glass wafer materials have demonstrated the current capabilities for this laser and mechanical singulation process and confirm the exceptional performance. A tiny die size of 150×150 μm is demonstrated on a 200 mm diameter, 150 μm thick glass wafer. The laser-based solution can be enhanced to ensure side-wall uniformity at the large number of intersecting lines found on densely packed wafers. Finally, the requirements of the clear aperture for the laser entrance can be reduced into the range below 100 μm by applying Corning’s fundamental process understanding and optimization of the laser optics.
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