Rogers Micro-Channel Coolers (MCC) cover a wide range of thermal management applications, such as laser diode heat sinks and CPU coolers. Apart from top-of-the-line thermal performance, some applications require a particularly homogeneous temperature distribution. In this paper, we present Finite-Element-Method (FEM) simulation results of a new MCC stack setup for single emitter laser diodes and a solid copper heatsink reference with variable heat transfer coefficient (α) on the bottom side. Characteristic curves for temperature (T), temperature difference (ΔT) between optical components and pressure drop are shown as a function of α and flow rate. We find a ΔT of less than 2 K between the semiconductor elements and a total T reduction of ⪆20 K compared to the reference heatsink.
The paper contains charts of the micro-channel structures´ simulation data from a benchmark done using air as a cooling medium. It is showing Rth and other performance data in comparison to needed air volume in m³/h. Therefore, several Rogers’ standard micro-channel-structures, such as Qua 50, 100, Hex 50 and off the shelf standard lamellar heat sinks were benchmarked in thermal simulations using Solid Works. Comparing the results at a given flow rate of 1 m³/h all Rogers’ cooling structures show a lower chip temperature then the reference coolers. This is due to a higher heat transfer coefficient of these cooling structures resulting in up to 43 % lower thermal resistances versus the benchmark. Summing up the results show a clear picture, for certain use cases Rogers’ micro-channel coolers can close a gap for customers using air cooling but reach the limits of current solutions and future needs
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