Dr. Guolin Xu Profile

Dr. Guolin Xu

at Institute of Bioengineering and Nanotechnology

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Publications (10)

Proceedings Article | 30 December 2008 Paper

Paramagnetic microchip for high-gradient separation of blood cell

Ciprian Iliescu, Guolin Xu, Elena Barbarini, Marioara Avram, Florina Iliescu

Proceedings Volume 7269, 726907 (2008) https://doi.org/10.1117/12.810713

KEYWORDS: Blood, Magnetism, Semiconducting wafers, Microfluidics, Glasses, Particles, Etching, Photomasks, Photoresist materials, Ferromagnetics

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Proceedings Article | 27 December 2007 Paper

Thermal analysis of cell electro-rotation chip

Guolin Xu, Daniel Lee, M. Vyshnavi, Jackie Ying

Proceedings Volume 6799, 67990K (2007) https://doi.org/10.1117/12.758180

KEYWORDS: Electrodes, Temperature metrology, Glasses, Semiconducting wafers, Dielectrics, Thermal analysis, Silicon, Finite element methods, Particles, Dielectrophoresis

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Proceedings Article | 29 November 2007 Paper

Large distance liquid pumping by AC electro-osmosis for the delivery of biological cells and reagents in microfluidic devices

Daniel Lee, Guolin Xu, Yongsheng Tng, Kyaw Zin Htet, Chun Yang, Jackie Ying

Proceedings Volume 6836, 68360A (2007) https://doi.org/10.1117/12.754098

KEYWORDS: Liquids, Electrodes, Multiplexing, Glasses, Microfluidics, Gold, Silicon, Particles, Chromium, Microelectromechanical systems

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Proceedings Article | 20 December 2006 Paper

Microfluidic device with asymmetric electrodes for cell and reagent delivery

Daniel Lee, Guolin Xu, Hong Kiat Tay, Chun Yang, Jackie Ying

Proceedings Volume 6415, 64150U (2006) https://doi.org/10.1117/12.695598

KEYWORDS: Electrodes, Microfluidics, Dielectrophoresis, Semiconducting wafers, Silicon, Particles, Gold, Deep reactive ion etching, Microelectromechanical systems, Glasses

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Proceedings Article | 14 December 2006 Paper

An electromechanical filter for bioparticles trapping

Ciprian Iliescu, Guolin Xu, Francis Tay, Poh Lam Ong

Proceedings Volume 6416, 64160G (2006) https://doi.org/10.1117/12.696623

KEYWORDS: Dielectrophoresis, Particles, Silica, Electrodes, Glasses, Semiconducting wafers, Digital filtering, Yeast, Dielectrics, Microfabrication

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Proceedings Article | 19 January 2006 Open Access

Cell separation technique in dilectrophoretic chip with bulk electrode

Ciprian Iliescu, Francis Tay, Guolin Xu, Liming Yu

Proceedings Volume 6036, 60360E (2006) https://doi.org/10.1117/12.638509

KEYWORDS: Dielectrophoresis, Electrodes, Particles, Microfluidics, Yeast, Glasses, Silicon, Semiconducting wafers, Photomasks, Wet etching

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Proceedings Article | 19 January 2006 Paper

A new fabrication process of silicon nanotips: NERCOM

Francis Tay, Ciprian Iliescu, Guolin Xu, Bangtao Chen, Marioara Avram

Proceedings Volume 6036, 603608 (2006) https://doi.org/10.1117/12.638516

KEYWORDS: Photoresist materials, Photomasks, Silicon, Reactive ion etching, Nanolithography, Plasma etching, Etching, Semiconducting wafers, Thermoelectric materials, Oxidation

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Proceedings Article | 29 December 2005 Paper

Characterization of deep wet etching of glass

Ciprian Iliescu, Bangtao Chen, Francis Tay, Guolin Xu, Jianmin Miao

Proceedings Volume 6037, 60370A (2005) https://doi.org/10.1117/12.638521

KEYWORDS: Etching, Glasses, Photomasks, Wet etching, Semiconducting wafers, Silicon, Photoresist materials, Amorphous silicon, Gold, Annealing

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This paper presents a characterization of wet etching of glass in HF-based solutions with a focus on etching rate, masking layers and quality of the generated surface. The first important factor that affects the deep wet etching process is the glass composition. The presence of oxides such as CaO, MgO or Al₂O₃ that give insoluble products after reaction with HF can generate rough surface and modify the etching rate. A second factor that influences especially the etch rate is the annealing process (560°C / 6 hours in N₂ environment). For annealed glass samples an increase of the etch rate with 50-60% was achieved. Another important factor is the concentration of the HF solution. For deep wet etching of Pyrex glass in hydrofluoric acid solution, different masking layers such as Cr/Au, PECVD amorphous silicon, LPCVD polysilicon and silicon carbide are analyzed. Detailed studies show that the stress in the masking layer is a critical factor for deep wet etching of glass. A low value of compressive stress is recommended. High value of tensile stress in the masking layer (200-300 MPa) can be an important factor in the generation of the pinholes. Another factor is the surface hydrophilicity. A hydrophobic surface of the masking layer will prevent the etching solution from flowing through the deposition defects (micro/nano channels or cracks) and the generation of pinholes is reduced. The stress gradient in the masking layer can also be an important factor in generation of the notching defects on the edges. Using these considerations a special multilayer masks Cr/Au/Photoresist (AZ7220) and amorphous silicon/silicon carbide/Photoresist were fabricated for deep wet etching of a 500 μm and 1mm-thick respectively Pyrex glass wafers. In both cases the etching was performed through wafer. From our knowledge these are the best results reported in the literature. The quality of the generated surface is another important factor in the fabrication process. We notice that the roughness of generated surface can be significantly improved by adding HCl in HF solution (the optimal ratio between HF (49%) and HCl (37%) was 10/1).

Proceedings Article | 16 February 2005 Paper

Dielectrophoretic chip with bulk silicon electrodes

Ciprian Iliescu, Guolin Xu, Francis Tay, Victor Samper

Proceedings Volume 5651, (2005) https://doi.org/10.1117/12.581022

KEYWORDS: Electrodes, Dielectrophoresis, Semiconducting wafers, Silicon, Glasses, Microfluidics, Etching, Oxides, Wafer bonding, Photoresist materials

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Proceedings Article | 16 February 2005 Paper

Self-priming and bubble tolerant micropump

Guolin Xu, Francis Tay, Ciprian Iliescu, Vincent Luar

Proceedings Volume 5651, (2005) https://doi.org/10.1117/12.581965

KEYWORDS: Silicon, Actuators, Prototyping, Head, Microfluidics, Liquids, Biotechnology, Nanotechnology, Nanolithography, Shape memory alloys

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Showing 5 of 10 publications

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