Prof. Holger Vogt Profile

Prof. Holger Vogt

at Fraunhofer IMS

SPIE Involvement:

Author

Publications (17)

Proceedings Article | 20 September 2020 Presentation + Paper

Scalable nanotube-microbolometer technology with pixel pitches from 12 down to 6 µm

M. Michel, S. Weyers, D. Weiler, S. Blaeser, E. Zakizade, F. Hochschulz, H. Vogt

Proceedings Volume 11537, 1153704 (2020) https://doi.org/10.1117/12.2573895

KEYWORDS: Microbolometers, Nanotechnology, Readout integrated circuits, Manufacturing, Electro optics, Resistance, Nanolithography, Microsystems, Digital electronics, Black bodies

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Proceedings Article | 31 January 2020 Presentation + Paper

Measurement concept to reduce environmental impact in direct time-of-flight LiDAR sensors

Jan Haase, Andre Buchner, Sara Grollius, Jennifer Ruskowski, Holger Vogt

Proceedings Volume 11288, 1128809 (2020) https://doi.org/10.1117/12.2546021

KEYWORDS: Time of flight range image sensors, 3D-TOF imaging, Single photon detectors, Photons, Pulsed laser operation, Sensors, Target detection, LIDAR, Environmental sensing, Distance measurement, Signal detection, Retroreflectors

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Proceedings Article | 1 February 2019 Presentation + Paper

Measurement concept for direct time-of-flight sensors at high ambient light

Jan Haase, Maik Beer, Olaf Schrey, Jennifer Ruskowski, Werner Brockherde, Holger Vogt

Proceedings Volume 10926, 109260W (2019) https://doi.org/10.1117/12.2509779

KEYWORDS: Optical filters, Bandpass filters, Reflectivity, Distance measurement, Sensors, LIDAR, Photodetectors, Light sources, Laser sources, Signal detection

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Proceedings Article | 9 October 2018 Paper

Digital uncooled IRFPAs based on microbolometers with 17 µm and 12 µm pixel pitch

Dirk Weiler, Frank Hochschulz, Claudia Busch, Matthias Stein, Marvin Michel, Andreas Kuhl, Renee Lerch, Martin Petermann, Thomas Geruschke, Sebastian Blaeser, Sascha Weyers, Holger Vogt

Proceedings Volume 10795, 1079504 (2018) https://doi.org/10.1117/12.2503423

KEYWORDS: Microbolometers, Readout integrated circuits, Sensors, Temperature metrology, Thermography, Black bodies, Infrared radiation, Semiconducting wafers

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Proceedings Article | 29 May 2018 Presentation + Paper

High-performance uncooled digital 17 μm QVGA-IRFPA-using microbolometer based on amorphous silicon with massively parallel Sigma-Delta-ADC readout

Dirk Weiler, Frank Hochschulz, Claudia Busch, Matthias Stein, Marvin Michel, Daniel Würfel, Renee Lerch, Martin Petermann, Thomas Geruschke, Sebastian Blaeser, Sascha Weyers, Holger Vogt

Proceedings Volume 10624, 1062419 (2018) https://doi.org/10.1117/12.2304866

KEYWORDS: Microbolometers, Semiconducting wafers, Amorphous silicon, Temperature metrology, Readout integrated circuits, Black bodies, Sensors, Analog electronics, Antireflective coatings, Interfaces

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Proceedings Article | 16 February 2017 Presentation + Paper

CMOS SiPM with integrated amplifier

Alexander Schwinger, Werner Brockherde, Bedrich Hosticka, Holger Vogt

Proceedings Volume 10100, 101001A (2017) https://doi.org/10.1117/12.2252516

KEYWORDS: Resistors, Sensors, Amplifiers, Capacitance, Electronics, Single photon detectors, Active sensors, Avalanche photodiodes, Silicon photomultipliers, Optoelectronics, Metals, Optical amplifiers, Measurement devices, Temperature metrology

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Proceedings Article | 20 May 2016 Paper

Measurement results of a 12 µm pixel size microbolometer array based on a novel thermally isolating structure integrated on a 17 µm ROIC

K.-M. Muckensturm, D. Weiler, F. Hochschulz, C. Busch, T. Geruschke, S. Wall, J. Heß, D. Würfel, R. Lerch, H. Vogt

Proceedings Volume 9819, 98191N (2016) https://doi.org/10.1117/12.2223608

KEYWORDS: Microbolometers, Electro optics, Readout integrated circuits, Absorption, Reflectors, Resistance, Semiconducting wafers, Infrared radiation, Nanolithography, Optical resonators

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Proceedings Article | 21 May 2015 Paper

Investigation of diaphragm deflection of an absolute MEMS capacitive polysilicon pressure sensor

C. Walk, A. Goehlich, A. Giese, M. Goertz, H. Vogt, M. Kraft

Proceedings Volume 9517, 95170T (2015) https://doi.org/10.1117/12.2176188

KEYWORDS: Sensors, Semiconducting wafers, Oxides, Data modeling, Microelectromechanical systems, Silicon, Low pressure chemical vapor deposition, Plasma enhanced chemical vapor deposition, Capacitance, CMOS sensors

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Proceedings Article | 5 May 2015 Paper

Modeling of CMOS image sensors for time-of-flight applications

Adrian Driewer, Bedrich Hosticka, Andreas Spickermann, Holger Vogt

Proceedings Volume 9506, 950603 (2015) https://doi.org/10.1117/12.2178390

KEYWORDS: Electroluminescent displays, Sensors, Doping, CMOS sensors, 3D modeling, Pulsed laser operation, Photodetectors, Systems modeling, Distance measurement, Modulation

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Proceedings Article | 24 June 2014 Paper

Uncooled digital IRFPA-family with 17μm pixel-pitch based on amorphous silicon with massively parallel Sigma-Delta-ADC readout

D. Weiler, F. Hochschulz, D. Würfel, R. Lerch, T. Geruschke, S. Wall, J. Heß, Q. Wang, H. Vogt

Proceedings Volume 9070, 90701M (2014) https://doi.org/10.1117/12.2050445

KEYWORDS: Microbolometers, Sensors, Semiconducting wafers, Amorphous silicon, Readout integrated circuits, Thermography, Packaging, Electro optics, Bolometers, Absorption

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Proceedings Article | 15 May 2014 Paper

Performance analysis of a large photoactive area CMOS line sensor for fast, time-resolved spectroscopy applications

Elena Poklonskaya, Daniel Durini, Melanie Jung, Olaf Schrey, Adrian Driewer, Werner Brockherde, Bedrich Hosticka, Holger Vogt

Proceedings Volume 9141, 914103 (2014) https://doi.org/10.1117/12.2051318

KEYWORDS: Sensors, CMOS sensors, Electrons, CCD image sensors, Silicon, Diffusion, Charge-coupled devices, Doping, Metals, Green light emitting diodes

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Proceedings Article | 21 May 2011 Paper

Improvements of a digital 25 µm pixel-pitch uncooled amorphous silicon TEC-less VGA IRFPA with massively parallel Sigma-Delta-ADC readout

Dirk Weiler, Marco Ruß, Daniel Würfel, Renee Lerch, Pin Yang, Jochen Bauer, Jennifer Heß, Piotr Kropelnicki, Holger Vogt

Proceedings Volume 8012, 80121F (2011) https://doi.org/10.1117/12.883791

KEYWORDS: Microbolometers, Amorphous silicon, Ceramics, Semiconducting wafers, Readout integrated circuits, Thermography, Resistance, Packaging, Electro optics, Analog electronics

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Proceedings Article | 28 October 2010 Paper

Fabrication method for chip-scale-vacuum-packages based on a chip-to-wafer-process

J. Bauer, D. Weiler, M. Ruß, J. Heß, P. Yang, J. Voß, N, Arnold, H. Vogt

Proceedings Volume 7834, 78340S (2010) https://doi.org/10.1117/12.865019

KEYWORDS: Semiconducting wafers, Tin, Bolometers, Infrared bolometers, Infrared radiation, Packaging, Reflectivity, Wafer bonding, Sensors, Plating

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Proceedings Article | 4 May 2010 Paper

A digital 25 µm pixel-pitch uncooled amorphous silicon TEC-less VGA IRFPA with massive parallel Sigma-Delta-ADC readout

Dirk Weiler, Marco Russ, Daniel Würfel, Renee Lerch, Pin Yang, Jochen Bauer, Holger Vogt

Proceedings Volume 7660, 76600S (2010) https://doi.org/10.1117/12.849839

KEYWORDS: Microbolometers, Amorphous silicon, Thermography, Semiconducting wafers, Bolometers, Modulators, Electro optics, Packaging, Antireflective coatings, Analog electronics

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