We present on the additive micro-manufacturing of ceramic packaging, containing arbitrarily routed vias with a diameter and pitch as small as 10µm and 20µm, respectively. We accomplish this feat by pairing recently commercialized micro-printers based on digital micromirror devices with our UV curable pre-ceramic resin that enables dielectric ceramic printing. Ceramic interposers with thousands of vias were 3D printed, then metallized and finally indium bump bonded to test chips fabricated by standard semiconductor lithography. This technology enables unprecedented via routing and packaging options for the 3D integration of microelectronic subsystems and focal plane arrays.
High resolution, wide field-of-view, infrared (IR) imagers find use in defense and civilian applications. The most demanding of them desire uniform sensitivity across an image’s field of view, while maintaining a small and light-weight optical design. These attributes can be achieved by curving of the focal plane array to reduce the need for field curvature correction. Using experimental and numerical methods, we investigated the spherical curving of hybridized arrays to demonstrate mechanical feasibility and opto-electronic performance. Each hybridized array comprised a 4k x 4k, 10 μm pixel pitch, midwave IR (MWIR) detector hybridized to a 67 mm diagonal fanout chip. We curve an array to 139.2 mm radius of curvature, resulting in a pixel area coverage of 0.086 sr. Measurements across the curved array revealed minimal variation in bandgap (<0.1 μm) and no appreciable difference in dark current.
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