Electronic devices are widely used in various industries, their temperature distribution cannot be obtained by traditional
test methods. In recent years, simulation softwares are used to simulate the thermal characteristics of electronic devices
and play a positive role on the reliability improvement, on the contrast, their validity cannot be verified. In this paper, the
chip temperature rise process is simulated by ICEPEAK software. Some factors that change thermal characteristics are
analyzed. The actual working temperature obtained by the thermal microscope is compared with the simulation
temperature. The validity of simulation temperature is tested and the relation is built between the actual temperature and
simulation temperature. Finally, it is pointed that thermal microscopes are the development direction on the electronic
devices design and reliability testing.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.