Integrating Photonic-Integrated Circuits (PICs) into microfluidic devices for diagnostics faces several challenges such as handling small PICs, ensuring interface access, managing temperature and UV sensitive coatings, and maintaining bubble-free sample transfer. CSEM offers unique services merging cleanroom packaging, microfluidic design, and prototyping, aiding PIC and diagnostics industry partners.
Collaborations with different partners have led to tailored PIC integration solutions for sepsis detection, bioreactor contamination detection, food safety testing, and extracellular vesicle detection. CSEM's packaging for small PICs drastically reduces costs (up to 10-fold) and enhances market competitiveness.
Leveraging simulations for fluid dynamics and chemical interaction optimizes development, increasing detection speed in one case by around 4000 times. CSEM has also pioneered in-line degassing, on-cartridge heating, and liquid storage solutions.
Our upcoming talk will explore these challenges and present solutions within specific use cases.
Photonics integration continues to be a main driver for innovation in multiple aspects, including wafer-scale integration, new materials, sub-micron alignment of components and protection from harsh environment. We show cost-effective fabrication technologies of micro-optical components by UV wafer-scale replication into chemically stable polymers. Furthermore, for simplified fiber coupling and packaging, a novel 90° optical interconnect is presented, integrated with self-alignment structures. Replicated, space compliant microlenses on packaged CMOS imagers show improved light sensitivity by a factor 1.8. A laser based, low stress bonding process is explored to generate wafer-scale hermetic enclosures for harsh environment applications ranging from space to implants.
This paper summarizes the results of an EU project called ACTION: ACTive Implant for Optoacoustic Natural sound
enhancement. The project is based on a recent discovery that relatively low levels of pulsed infrared laser light are capable
of triggering activity in hair cells of the partially hearing (hearing impaired) cochlea and vestibule. The aim here is the
development of a self-contained, smart, highly miniaturized system to provide optoacoustic stimuli directly from an array
of miniature light sources in the cochlea. Optoacoustic compound action potentials (oaCAP) are generated by the light
source fully inserted into the unmodified cochlea. Previously, the same could only be achieved with external light sources
connected to a fiber optic light guide. This feat is achieved by integrating custom made VCSEL arrays at a wavelength of
about 1550 nm onto small flexible substrates. The laser light is collimated by a specially designed silicon-based ultra-thin
lens (165 um thick) to get the energy density required for the generation of oaCAP signals. A dramatic miniaturization of
the packaging technology is also required. A long term biocompatible and hermetic sapphire housing with a size of less
than a 1 cubic millimeter and miniature Pt/PtIr feedthroughs is developed, using a low temperature laser assisted process
for sealing. A biofouling thin film protection layer is developed to avoid fibrinogen and cell growth on the system.
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