Scaled technology node, SRAMs suffer from increased Bit Line (BL) and Word Line (WL) resistance. To solve these issues, we present SRAM bit-level BL and WL metallization and options suitable for both SADP an EUV. We also present Buried power Rail (BPR) SRAM as enablers for high density SRAM cells (HD-111) in scaled technology nodes for 5nm and beyond and illustrate system level advantages of BPR SRAM with BPR based power delivery network of a hard macro like Arm 64-bit CPU.
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