Moshe Dolejsi
Integration Engineer at Intel Corporation
SPIE Involvement:
Author
Publications (2)

SPIE Journal Paper | 6 September 2018 Open Access
JM3, Vol. 17, Issue 03, 031204, (September 2018) https://doi.org/10.1117/12.10.1117/1.JMM.17.3.031204
KEYWORDS: Metals, Directed self assembly, Polymethylmethacrylate, Oxides, Copper, Dielectrics, Picosecond phenomena, Thermodynamics, Aluminum, Semiconducting wafers

Proceedings Article | 17 April 2018 Presentation + Paper
Proceedings Volume 10586, 105860P (2018) https://doi.org/10.1117/12.2300859
KEYWORDS: Metals, Directed self assembly, Oxides, Copper, Polymethylmethacrylate, Dielectrics, Polymers, Semiconducting wafers, Picosecond phenomena, Thermodynamics

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