The intent of this investigation is to replace the low fill
factor visible sensor of a Cellular Neural Network (CNN) processor
with an InGaAs Focal Plane Array (FPA) using both bump bonding
and epitaxial layer transfer techniques for use in the Ballistic Missile
Defense System (BMDS) interceptor seekers. The goal is to fabricate
a massively parallel digital processor with a local as well as a global
interconnect architecture. Currently, this unique CNN processor is
capable of processing a target scene in excess of 10,000 frames per
second with its visible sensor. What makes the CNN processor so
unique is that each processing element includes memory, local data
storage, local and global communication devices and a visible sensor
supported by a programmable analog or digital computer program.
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