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Dr. Rongmei Chen
at imec
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Publications (1)
Proceedings Article | 28 April 2023 Presentation + Paper
System-level evaluation of 3D power delivery network at 2nm node
Giuliano Sisto, Rongmei Chen, Dragomir Milojevic, Odysseas Zografos, Pieter Weckx, Geert Hellings, Julien Ryckaert
Proceedings Volume 12495, 124950Y (2023) https://doi.org/10.1117/12.2656469
KEYWORDS: Metals, Design and modelling, 3D acquisition, Wafer bonding, Dysprosium, Back end of line, Semiconducting wafers, Electronic design automation, Logic, 3D image capture
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