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Shih-Ping Chang
at Siliconware Precision Industries Co Ltd
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Publications (1)
Proceedings Article | 20 June 2021 Poster
Advanced measurement method for PIPBODAF film thickness of Fan out package
Proceedings Volume 11782, 117821O (2021) https://doi.org/10.1117/12.2598980
KEYWORDS: Fluctuations and noise, Packaging, Semiconductors, Semiconducting wafers, Reflection, Near infrared, Multilayers, Copper, Confocal microscopy
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