Biobased/green polymers and nanotechnology warrant a multidisciplinary approach to promote the development of the next generation of materials, products, and processes that are environmentally sustainable. The scientific challenge is to find the suitable applications, and thereby to create the demand for large scale production of biobased/green polymers that would foster sustainable development of these eco-friendly materials in contrast to their petroleum/fossil fuel derived counterparts. In this context, this research aims to investigate the synergistic effect of green materials and nanotechnology to develop a new family of multifunctional biobased polymer composites with promoted thermal conductivity. For instance, such composite can be used as a heat management material in the electronics industry. A series of parametric studies were conducted to elucidate the science behind materials behavior and their structure-toproperty relationships. Using biobased polymers (e.g., polylactic acid (PLA)) as the matrix, heat transfer networks were developed and structured by embedding hexagonal boron nitride (hBN) and graphene nanoplatelets (GNP) in the PLA matrix. The use of hybrid filler system, with optimized material formulation, was found to promote the composite’s effective thermal conductivity by 10-folded over neat PLA. This was achieved by promoting the development of an interconnected thermally conductive network through structuring hybrid fillers. The thermally conductive composite is expected to afford unique opportunities to injection mold three-dimensional, net-shape, lightweight, and eco-friendly microelectronic enclosures with superior heat dissipation performance.
Designers of electronic devices and telecommunications equipment have used three-dimensional chip architecture,
comprised of a vertically integrated stack of chips, to increase the number of transistors on integrated circuits. These
latest chips generate excessive amount of heat, and thus can reach unacceptably high temperatures. In this context, this
research aims to develop thermally conductive liquid crystal polymer (LCP)/hexagonal boron nitride (hBN) composite
films to replace the traditionally-used Kapton films that satisfy the electrical insulation requirements for the attachment
of heat sinks to the chips without compromising the heat dissipation performance. Parametric study was conducted to
elucidate the effects of hBN contents on the heat dissipation ability of the composite. The performance of the hybrid heat
sinks were experimentally simulated by measuring the temperature distribution of the hybrid heat sinks attached to a 10
W square-faced (i.e., 10 cm by 10 cm) heater. Experimental simulation show that the maximum temperature of the
heater mounted with a hybrid heat sink reduced with increased hBN content. It is believed the fibrillation of LCP matrix
leads to highly ordered structure, promoting heat dissipation ability of the electrically insulating pad of the hybrid heat
sink.
Today's smaller, more powerful electronic devices, communications equipment, and lighting apparatus required
optimum heat dissipation solutions. Traditionally, metals are widely known for their superior thermal conductivity;
however, their good electrical conductivity has limited their applications in heat management components for
microelectronic applications. This prompts the requirement to develop novel plastic composites that satisfy
multifunctional requirements thermally, electrically, and mechanically. Furthermore, the moldability of polymer
composites would make them ideal for manufacturing three-dimensional, net-shape enclosures and/or heat management
assembly. Using polyphenylene sulfide (PPS) as the matrix, heat transfer networks were developed and structured by
embedding hexagonal boron nitride (BN) alone, blending BN fillers of different shapes and sizes, as well as hybridizing
BN fillers with carbonaceous nano- and micro-fillers. Parametric studies were conducted to elucidate the effects of
types, shapes, sizes, and hybridization of fillers on the composite's thermal and electrical properties. The use of hybrid
fillers, with optimized material formulations, was found to effectively promote a composite's thermal conductivity. This
was achieved by optimizing the development of an interconnected thermal conductive network through structuring
hybrid fillers with appropriate shapes and sizes. The thermal conductive composite affords unique opportunities to
injection mold three-dimensional, net-shape microelectronic enclosures with superior heat dissipation performance.
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