Prof. Sung Pil Chang Profile

Prof. Sung Pil Chang

at Inha Univ

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Author

Publications (4)

SPIE Journal Paper | 18 May 2015

Optimizing the response time of Ni-based resistive temperature detectors

Deok Su Kim, Kyo Sang Choi, Hee Jun Yang, Min Soo Ryu, Ji Sung Chae, Sung Pil Chang

JM3, Vol. 14, Issue 02, 025002, (May 2015) https://doi.org/10.1117/12.10.1117/1.JMM.14.2.025002

KEYWORDS: Resistors, Sensors, Resistance, Temperature metrology, Time metrology, Reliability, Micromachining, Metals, Photoresist materials, Temperature sensors

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SPIE Journal Paper | 9 April 2015

Comparison and analysis of capacitive humidity sensors with water vapor inlet holes of different depths

Kyo Sang Choi, Deok Su Kim, Hee June Yang, Min Soo Ryu, Ji Sung Chae, Sung Pil Chang

JM3, Vol. 14, Issue 02, 025001, (April 2015) https://doi.org/10.1117/12.10.1117/1.JMM.14.2.025001

KEYWORDS: Sensors, Humidity, Electrodes, Dielectrics, Etching, Capacitance, Photoresist materials, Microelectromechanical systems, Manufacturing, Double patterning technology

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This paper describes the design, fabrication, and characterization of a capacitive humidity sensor with water vapor inlet holes of different depths. The humidity sensors were composed of a SiO2 insulation layer, a bottom electrode, a polyimide (PI) sensing layer, and a top electrode containing water vapor inlet holes. The sensors were 3.5 mm×3.5 mm with a 0.7-μm thick PI-based sensing layer. A humidity sensor with a partially etched PI layer in the water vapor inlet holes had the following characteristics: sensitivity 1500 fF/%RH, hysteresis 0.37%, and a response time of 70 s.

Proceedings Article | 16 February 2010

Development of integration technology for optical PCB and electrical PCB

Doo Yeol Cha, Se Jun Cho, Jai Hyuk Lee, Sung Pil Chang

Proceedings Volume 7605, 76050U (2010) https://doi.org/10.1117/12.844663

KEYWORDS: Optical printed circuit boards, Electroplating, Polymers, Temperature metrology, Copper, Data transmission, Integrated optics, Optical interconnects, Plating, Selenium

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As the demands for the higher data transmission capacity and speed as well as higher integration density grow throughout the network, much works have being done in order to integrate the Electrical PCB with Optical PCB. In this paper, among the key technologies to integrate the Electrical PCB with Optical, the technology for getting the via interconnection line with low resistivity using pulse mode electroplating method and bonding technology for high bonding strength with low temperature process are studied. As a result of this study, the measured value of electrical resistivity shows with a range from 20 to 26 mΩ and the PCB bonding technology with high bonding strength is demonstrated with the value of bonding strength from 7 to 8 MPa.

SPIE Journal Paper | 1 July 2009

Electric and magnetic field effects on the magnetostrictive thin film for MEMS

Heung-Shik Lee, Chongdu Cho, Dae-Seok Shin, Sung Pil Chang

JM3, Vol. 8, Issue 03, 039701, (July 2009) https://doi.org/10.1117/12.10.1117/1.3196431

KEYWORDS: Magnetostrictive materials, Magnetism, Thin films, Silicon, Actuators, Microelectromechanical systems, Capacitance, Iron, Sputter deposition, Thin film deposition

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We present the control of magnetostriction and magnetization of the magnetostrictive thin film via additional electric field with original low magnetic field for microelectromechanical systems (MEMS) application. To examine the electric field effect on the magnetostrictive thin film deposited on each substrate, Si and polyimide (Kapton, Dupont Corp.) substrates are used. During the measurement of magnetization and magnetostriction, 0-to 50-V electric fields are applied under 0.5-T magnetic fields. As a result, 3% of magnetostriction is enhanced compare with no electric field.

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