CONFERENCE PROCEEDINGS
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Tien-Jung Lee
at KLA Corp.
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Author
Publications (3)
Proceedings Article | 10 April 2024 Poster + Paper
High throughput 3D NAND structure monitoring by x-ray scattering
Ying Gao, Tian Lan, Osman Sorkhabi, Jin Zhang, Yung-Yi Lin, Maggie Li, Tien-Jung Lee, Dave Oak, Christopher Liman, Boxue Chen, Zhengquan Tan
Proceedings Volume 12955, 129553A (2024) https://doi.org/10.1117/12.3010944
KEYWORDS: Etching, Scattering, X-rays, Structural monitoring, 3D modeling, Visualization, Contour extraction, 3D metrology, Satellites, Modeling
Proceedings Article | 10 April 2024 Poster + Paper
Global tilt measurement on irregular PIL supporting patterns in 3D NAND memory
Yung-Yi Lin, Tien-Jung Lee, Hsiao-Fei Su, Yen-Hung Liu, Chao-Yu Cheng, Christopher Liman, Boxue Chen, Zhengquan Tan, Ming-Tsung Wu, Min-Hsuan Huang, Yao-Yuan Chang, Hong-Ji Lee, Nan-Tzu Lian
Proceedings Volume 12955, 129552Z (2024) https://doi.org/10.1117/12.3010532
KEYWORDS: Etching, Semiconducting wafers, Metrology, Diffraction, 3D metrology, X-rays, 3D modeling, Silicon nitride, Scanning electron microscopy, X-ray diffraction
Proceedings Article | 10 April 2024 Poster + Paper
Global tilt extraction for BEOL contact landing displacement control
Yung-Yi Lin, Tien-Jung Lee, Hsiao-Fei Su, Yen-Hung Liu, Chao-Yu Cheng, Christopher Liman, Boxue Chen, Zhengquan Tan, Yuan-Chieh Chiu, Chiung-Kun Huang, Ying-Hung Liang, Hong-Ji Lee, Nan-Tzu Lian
Proceedings Volume 12955, 1295532 (2024) https://doi.org/10.1117/12.3010726
KEYWORDS: X-rays, Semiconducting wafers, Etching, Metrology, 3D metrology, Back end of line, Scattering, 3D modeling, Transmission electron microscopy, Optical alignment
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