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Dr. Wei-Sheng Lei
Sr. Technologist at Applied Materials Inc
SPIE Involvement:
Author
Publications (1)
Proceedings Article | 13 January 2005 Paper
Solid state UV laser technology for electronic packaging applications
Weisheng Lei, John Davignon
Proceedings Volume 5629, (2005) https://doi.org/10.1117/12.571520
KEYWORDS: Laser drilling, Ultraviolet radiation, Copper, Laser applications, Packaging, Glasses, Solid state electronics, Laser processing, Dielectrics, Beam shaping
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