A compact scanning deflectometer is presented for the fast topography measurement of semiconductor wafers. The technique, however, is equally well suited for any flat or slightly curved specular reflective surface. The measurement principle is based on the 2D measurement of the local slope vector by means of a narrow Laser beam scanning rapidly across the sample surface. The fast linear scanning is combined with sample rotation to measure the complete surface of circular samples. There is no physical contact to the measured surface. The topography of the sample is derived from the slope data by a novel 2D integration method, which is robust with respect to noise in the slope signals. We present the full-size topography of unpatterned and patterned wafers of different polishing quality.
We present an extremely simple and powerful test set-up for measuring the position and the focal line straightness (lateral) and flatness (longitudinal) of cylindrical lenses, in particular of very long cylindrical lenses. Measurement results are presented for 330 mm and 650 mm long plano- convex cylindrical lenses with a focal length f approximately equals 48 mm, showing that a (lateral) straightness measurement accuracy of about +/- 1 micrometers is achieved easily with a set-up using not much more than a laser, a simple beam deflector from a barcode scanner, a PSD (position-sensitive photo diode) with associated electronics and a translation stage. A fully automated cylindrical lens test set-up version, using a PC for control and data processing will be explained. For the 330 mm long cylindrical lenses, the lateral straightness showed better than between 3 and 10 micrometers (peak to peak) and the longitudinal flatness between 20 and 80 micrometers (peak to peak) without corrective bending. It will be demonstrated that the aberration coefficients, as measured by this physical ray tracing approach, are in accordance with the results from numerical simulation by means of a commercially available ray-tracing program.
Scanning Deflectometry is a powerful method to measure optical figure quality of various optical components and systems in a simple way. This principle uses detection of slope deviations rather than optical path length variations. As an example, the design of a basic deflectometer for testing flat mirrors is presented.
Scanning Deflectometry is a powerful method to measure optical figure quality of various optical components and system in a simple way. This principle uses detection of slope deviations rather than optical path length variations. As an example, the design of a basic deflectometer for testing flat mirrors is presented.
Long cylindrical mirror sections with an 'Alliptical' cross- section and an interfoci distance of approximately 1 m can be produced by means of diamond fly cutting. However, because of the finite tool radius, the generated profile is basically not an ellipse, but an equidistant ellipse or 'Allipse'. By numerical ray tracing analysis two unique conjugated 'A-points' can be found that are optically nearly equivalent with pure elliptical focal points. A reversed modeling procedure is used to predict the optimum machine configuration for producing just the required ellipse sections. Optical figure quality, focal line position and straightness are tested by a simple deflectometer set-up.
With 'Banana Technology' an unconventional hybrid fabrication technology is indicated for the production of very large parabolic and hyperbolic cylindrical mirror systems. The banana technology uses elastic bending of very large and thin glass substrates and fixation onto NC milled metal moulds. This technology has matured during the last twenty years for the manufacturing of large telecentric flat-bed scanners. Two construction types, called 'internal banana' and 'external banana; are presented. Optical figure quality requirements in terms of slope and curvature deviations are discussed. Measurements of these optical specifications by means of a 'finishing rod' type of scanning deflectometer or slope tester are presented. Design constraints for bending glass and the advantages of a new process will be discussed.
A design study for a compact 3D scanner, called Coplan, is presented. The Coplan is intended to be used for high speed, in-line coplanarity and shape measurement of electronic components, like Ball Grid Arrays and Surface Mount Devices. The scanner should have a scan length of at least 2 inches and a resolution of 5 micrometers in all 3 dimensions. First an analysis of two different scan schemes is made: a so-called pre-objective scheme using an F-(theta) scan lens and a post- objective scheme using a so-called banana field flattener, consisting of a convex, cylindrical hyperbolic mirror and a concave, cylindrical parabolic mirror. Secondly, an analysis of height resolution requirements for triangulation and confocal depth sensing has been made. It is concluded that for both methods of depth sensing a synchronous scheme with a 50-60 degrees detection angle in cross scan direction is required. It is shown that a post-objective scheme consisting of a banana mirror system combined with triangulation height detection offers the best solution for the optical requirements.
The banana mirror system is an alternative approach for the design of telemetric laser scanners with a large scan format instead of using an f-(theta) scan lens. We developed an analytical model and a combination of a hyperbolic and a parabolic cylindrical mirror. This model is called the Ideal Scanner Model. We will introduce the concept of conical deflection and present the basic features of the ISM theory.
The banana mirror system is an alternative approach for the design of telecentric laser scanners with a large scan format instead of using an f-(theta) scan lens. We developed an analytical model describing the ideal banana scanner configuration, that consists of a converging beam which is deflected as a pure cone (generating a primary scan circle) and a combination of a hyperbolic and a parabolic cylindrical mirror. this model is called the Ideal Scanner Model (ISM). We will introduce the concept of conical deflection and present the basic features of the ISM theory.
An industrial 3D laser scanner is presented for measurement of solder paste screening quality in an automated PCB assembly line. The scanner provides telecentric illumination and imaging in a 305 mm (12') long scan line at a maximum rate of more than 1000 scans per second. Synchronized height measurement is performed using a double triangulation scheme at large angles and wide aperture. Pixel sizes range down to 18 micrometers , yielding more than 16,000 pixels in a scan line. Depth resolution is 10 micrometers over a 2.5 mm measuring range. Some practical details on scanner assembly will be discussed. Combined with accurate, fast processing and control electronics this 3D sensor enables 100% inspection at high production speeds.
A new industrial 3D laser scanner is presented for measurement of solder paste screening quality in an automated PCB assembly line. Its unique scan optics provide telecentric illumination and imaging on a long scan line of 305 mm (12') at a maximum rate of more than 1000 scans per second. Synchronized height measurement is performed using a double triangulation scheme at large angles and wide aperture by means of a confocal like design based on elliptical mirrors. Using a spot size of 20 micrometers multiplied by 30 micrometers (FWHM), lateral resolution can be set electronically down to 10 micrometers pixel size. Depth resolution is 10 micrometers over a 2.5 mm measuring range. Combined with accurate and fast processing and control electronics this 3D sensor enables full 100% inspection at production speed.
A family of high performance industrial laser scanners has been developed at Philips, based on a unique, reflective, field flattening system as an alterative for f-(Theta) scan lenses that are usually applied in laser scanners. This novel scan approach enables pure telecentric and flat field scanning of wide formats at very high resolution and speed. The attractive features of this particular scan concept are demonstrated by two different 2-D industrial inspection problems that have been solved at Philips during the last ten years.
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