Mr. Xiaonan Zhang Profile

Xiaonan Zhang

at Luoyang Optoelectro Technology Development Center

SPIE Involvement:

Author

Publications (1)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 25 October 2016 Paper

Study on failure analysis of array chip components in IRFPA

Xiaonan Zhang, Yingjie He, Jinping Li

Proceedings Volume 10157, 1015715 (2016) https://doi.org/10.1117/12.2245803

KEYWORDS: Failure analysis

Read Abstract +

Infrared focal plane array detector has advantages of strong anti-interference ability and high sensitivity. Its size, weight and power dissipation has been noticeably decreased compared to the conventional infrared imaging system. With the development of the detector manufacture technology and the cost reduction, IRFPA detector has been widely used in the military and commercial fields. Due to the restricting of array chip manufacturing process and material defects, the fault phenomenon such as cracking, bad pixel and abnormal output was showed during the test, which restricts the performance of the infrared detector imaging system, and these effects are gradually intensified with the expanding of the focal plane array size and the shrinking of the pixel size.

Based on the analysis of the test results for the infrared detector array chip components, the fault phenomenon was classified. The main cause of the chip component failure is chip cracking, bad pixel and abnormal output. The reason of the failure has been analyzed deeply. According to analyze the mechanism of the failure, a series of measures which contain filtrating materials and optimizing the manufacturing process of array chip components were used to improve the performance of the chip components and the test pass rate, which is used to meet the needs of the detector performance.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years