Presentation + Paper
9 April 2024 Functional underlayers, surface priming, and multilayer stacks to improve dose and adhesion of EUV photoresists
Author Affiliations +
Abstract
A large screening of underlayer materials for extreme ultraviolet lithography is reported in this work. The main motivation for the screening of functional materials lies in the search for dose reduction and defect mitigation. Some promising results shown in here prove that the usage of functionalized underlayers and primers improves the pattern quality without adding to the complexity of litho processing.
Conference Presentation
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Roberto Fallica, Lander Verstraete, Weizhong Huang, Mihir Gupta, Danilo De Simone, Si (Elly) Li, Daniel Sweat, Douglas J. Guerrero, and Kodai Kato "Functional underlayers, surface priming, and multilayer stacks to improve dose and adhesion of EUV photoresists", Proc. SPIE 12957, Advances in Patterning Materials and Processes XLI, 1295712 (9 April 2024); https://doi.org/10.1117/12.3009801
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KEYWORDS
Extreme ultraviolet lithography

Photoresist materials

Adhesion

Etching

Semiconducting wafers

Extreme ultraviolet

Amorphous carbon

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