Paper
11 March 2002 Extended chamber matching and repeatability study for chrome etch
Yi-Chiau Huang, Melisa J. Buie, Brigitte C. Stoehr, Alex H. Buxbaum, Guenther G. Ruhl
Author Affiliations +
Abstract
Shrinking design rules, optical proximity correction and advanced phase shifting techniques require new methods of photomask manufacturing. The Applied Materials Centura photomask etch chamber leverages Applied Materials' extensive etch experience to provide an innovative dry etch solution to the mask dry etch challenges for < 0.13 micrometers device generations. Repeatable, consistent, stable etch performance is critical for advanced mask manufacturing. An extended chamber matching and repeatability study for chrome etch found that stable chrome and photoresist etch rates (and therefore selectivities) are produced on the Applied Materials Centura photomask etch chamber. The etch responses are consistent mask to mask as well as chamber to chamber. Prior to the extended study, pumping efficiencies, RF source and bias calibrations and optical emission spectral responses were compared. Since the study was performed at several different sites, the metrology tools were calibrated using masks specifically designed for this purpose. The marathon testing illustrates the stable etch performance over time.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yi-Chiau Huang, Melisa J. Buie, Brigitte C. Stoehr, Alex H. Buxbaum, and Guenther G. Ruhl "Extended chamber matching and repeatability study for chrome etch", Proc. SPIE 4562, 21st Annual BACUS Symposium on Photomask Technology, (11 March 2002); https://doi.org/10.1117/12.458344
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Cited by 1 scholarly publication and 3 patents.
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KEYWORDS
Etching

Photoresist materials

Photomasks

Chlorine

Chromium

Plasma

Calibration

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