The Journal of Micro/Nanopatterning, Materials, and Metrology (JM 3) publishes peer-reviewed papers on the core enabling technologies that address the patterning needs of the electronics industry. Formerly the Journal of Micro/Nanolithography, MEMS, and MOEMS, the journal’s key subject areas include the science, development, and practice of lithographic, computational, etch, and integration technologies. In this context the electronics industry includes but is not limited to integrated circuits and multichip modules, and advanced packaging with features in the submicron regime.
On the cover: The figure is from "Mitigating pattern collapse in high-resolution EUV lithography using the organic dry development rinse process" by Seonggil Heo et al. in Vol. 23, Issue 3.
