Contrary to traditional analysis flows as expensive FEM simulation tools or inaccurate electrical models extractors, we developed MemsCompiler that implements a new real synthesis approach for RF MEMS. The new flow starts from system designer requirements and generates, in a one-click operation, a ready-to-fabricate layout (GDSII) and a passive fitted equivalent Spice circuit.
Concerning the circuit, physical considerations give us an equivalent schematic in which circuit parameters values must be adjusted to fit the required performances. As to the GDSII, which constitutes the main contribution of this work, Design Of Experiment technique, used in the first version of the synthesizer, gave about 11% of dispersion and found to be unsatisfactory in some cases. A more accurate modeling was indispensable.
Thus, we developed a neural networks-based modeling for circular inductors, which are considered by designers among the most stubborn components. This new modeling has shown to be very accurate: MemsCompiler produced about 3% of dispersion compared to the equivalent circuit and about 6% of dispersion for generated geometries. This modeling is flexible and could be rapidly generalized to other components.
RF-MEMS Compiler uses a component synthesis approach instead of the more traditional analysis approach. It starts from system designer requirements and creates, in a one-click operation, a ready-to-fabricate layout and a passive equivalent SPICE circuit (when relevant). This methodology shortcuts the trial and error procedure which is long, difficult, and offers no guarantee of obtaining the targeted performances. Furthermore, no single designer typically has the skills needed to effectively carry out these tasks. As demonstrated in the case of inductors, the approach can be easily generalized to any RF-MEMS component fabricated through a predefined process. First results are very promising. The inductor compiler lost no more than 5% accuracy compared to the equivalent circuit and produced no more than 11% dispersion of the generated geometry.
High volume ICs production companies show a growing interest in MEMS components. Telecom MEMS are reaching the industrialization stage. Prototypes of integrated inductances and optical switches demonstrate very promising performances. The transition to the high volume production implies the development of Design For Manufacturability (DFM) tools featured to handle MEMS specific processes and related problems such as yield loss due to process dispersion. This paper presents an original statistical optimization method for yield enhancement. The corresponding algorithm is currently developed by MEMSCAP and LIRMM, based on response variability minimization.
Reducing design cycle time is a main concern of CAD tools. MEMS designers particularly suffer from a long and difficult design procedure in which different phases are involved: solid modeling, meshing and simulation. In this paper, we present, MEMS Max, the new MEMSCAP environment fully oriented towards RF-MEMS designers. It brings to the designer flexible, complete and easy-to-use RF MEMS-oriented tools. At the same time, it reduces efficiently the design cycle time.
High volume ICs production companies (telecom, etc) show a growing interest in MEMS components, especially RF and optical ones. Prototypes of integrated inductances and optical switches demonstrate very promising performances. The transition to the high volume production implies the development of Design For Manufacturability (DFM) tools featured to handle MEMS specific processes and related problems such as yield loss due to process dispersion. These tools must be part of a MEMS dedicated CAD environment. This paper presents results of what could be yield enhancement using usual statistical optimization tools and methods, and a new approach currently developed by MEMSCAP and LIRMM, based on response variability minimization.
KEYWORDS: Systems modeling, Microelectromechanical systems, Finite element methods, 3D modeling, Data modeling, Instrument modeling, Micromirrors, Electronics, Packaging, Device simulation
System designers need access to high-fidelity behavioral models in order to simulate system of MEMS, electronics and packaging. Therefore, the need exists to create behavioral models that provide accurate harmonic and time-domain solutions in a fast and efficient manner. In the MEMSCAP MEMS design suite, the EDD family of tools enables the generation of non-linear dynamic behavioral models from models with a hierarchically lower level of abstraction or measured data. In this paper, we report on a new module of EDD, the ANSYS ModelBuilder, which is embedded in the ANSYS Multi-physics tool set. The module reduces the dimensionality of FEM models built in ANSYS and writes them in popular modeling languages such as HDL-A, SPICE, VHDL-AMS and Verilog-A. We illustrate the capabilities of our new tool by utilizing it to develop two system level examples and compare the results to the full 3D descriptions.
KEYWORDS: Microelectromechanical systems, 3D modeling, Finite element methods, Integration, Computer aided design, Data modeling, Anisotropic etching, Systems modeling, Visualization, Solids
This paper presents a fully integrated solution for the development of Micro Electro Mechanical Systems which covers component libraries, design tools and designs methodologies which are used in conjunction with conventional design automation tools. This solutio enables system houses in wireless and optical communications and consumers electronics markets to reduce their internal development costs and significantly accelerate their product development cycles.
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