In this work we explain the methodology and techniques for building an end-to-end design enablement (DE) platform from component design to process design kit (PDK) release for silicon photonics-based photonic integrated circuit (PIC) design. Elements of the DE include: component design, layout and test site development, measurement infrastructure and PDK development. Our methodology builds on the best practices followed in CMOS and RF foundries but adds unique features specific to silicon photonics. The DE flow is developed on the American Institute for Manufacturing Integrated Photonics’ (AIM Photonics) 300 mm silicon photonic technologies manufactured in a limited-volume foundry at the Albany Nanotech Complex, in Albany, NY. For component development, the AIM Photonics PDK offers a process stack file supported in Lumerical platform that applies linewidth corrections and doping information to imported layouts increasing the efficiency and accuracy of the design. For test sites, an automated layout and connectivity framework is explained that allows users to generate a layout from spreadsheet inputs that is also compatible with automated waferscale measurements. AIM Photonics PDKs include layout, models and design-rule-check (DRC) tools that are offered across multiple platforms. The DRC decks are offered in commercial tools such as Cadence and Synopsys, as well as KLayout. We present features of layouts and communication with schematics. In addition, we also explain techniques for processing and analyzing measured statistical data and extracting platform specific compact models. Presenting this methodology to the wider community is integral to the mission of AIM Photonics and will be of immense benefit particularly to small organizations engaged in prototype development.
Optical coupling between fibers and on-chip waveguides is a critical step in photonic testing and packaging. We demonstrated broadband surface-normal fiber-to-chip optical coupling based on free-form micro-optical reflector arrays integrated with foundry-processed SiN photonics. The couplers yield a low fiber-to-waveguide coupling loss of 0.5 dB at 1550 nm wavelength, and an exceptionally broad 1-dB bandwidth encompassing O to L bands (1260 nm to 1640 nm), only limited by the wavelength range of our testing setup. In-plane 1-dB alignment tolerances up to ± 2.4 µm and an out-of-plane 1-dB alignment tolerance up to 20 µm were obtained at 1550 nm. We further show that the Optical Free-Form Couplers for High-density Integrated Photonics (OFFCHIP) platform is universally applicable for chip-to-chip, waveguide to free space, and waveguide to surface-normal device coupling, qualifying it as a universal high-performance optical coupling interface for diverse use scenarios.
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