We present results of a method to calculate the numerical aperture and diffraction-limited Airy radius (AR) in a non-sequential (NSQ) ray-trace simulation which results in <0.05% difference in AR when compared with sequential (SEQ) methodology.
Diffractive optical devices are essential in developing compact and thin augmented reality (AR) devices. Surface-reliefgratings (SRG) and volume-holographic gratings (VHG) are typical gratings with periodic material changes. VHG is relatively easy to manufacture, making it a popular choice for R&D teams developing AR exit pupil expander (EPE) applications. In the past, the Kogelnik algorithm was combined with the Ansys Zemax OpticStudio ray tracing engine to simulate VHG for AR applications. However, due to its more approximate calculations, the accuracy of this method is lower than that of the rigorous coupled wave analysis (RCWA) method. This study aims to investigate the theoretical differences between the Kogelnik and RCWA methods, implement their algorithms in practice, and compare the accuracy of the two methods for AR EPE applications using the Zemax OpticStudio ray tracing engine.
This poster describes a new end-to-end virtual prototype solution we have developed for simulating the performances of the whole system of a CMOS Image Sensor Camera from the imaging lens system to the final image, through the optoelectronic sensor itself. Finite Difference Time Domain (FDTD) software is used to simulate how much light is absorbed by the CMOS sensor structure and the diffraction effects throughout the micro-lenses and pixels. 3D Charge Transport Solver is used to compute the probability to capture a photogenerated charge and get the quantum efficiency as a function of the incident angles, wavelengths, and pixel position. Finally, we combine light exposure onto the sensor from 3D environment raytracing software with quantum efficiency from photonics simulations to generate raw images and compute the final image.
Optical inspection systems allow faster detection of defects on semiconductor wafers than scanning electron microscopy (SEM) inspection systems. However, optical detection becomes more challenging as the structure feature size shrinks below the optical diffraction limit with the advancement of technology nodes in semiconductor manufacturing. To overcome this challenge and achieve optimal performance, the optical system must be tailored to the specific characteristics of the wafer sample which requires knowledge of the underlying microscopic and macroscopic optical phenomena. In this work, we proposed a multiphysics simulation workflow to model the microscopic light interaction with the wafer sample using Ansys Lumerical FDTD and the macroscopic optics of the inspection system using Ansys Zemax OpticStudio. The optimum optical system design with maximum defect signal strength could be achieved through defect image analysis. Together, FDTD and OpticStudio facilitate the design of complex optical inspection systems and reduce the cycle time for creating inspection recipes in the development of advanced technology nodes in semiconductor manufacturing.
Efficient fiber-to-waveguide coupling is critical for photonic integrated circuits. However, it is very challenging because of the mode mismatch and high sensitivity to misalignment between the fiber and the waveguide. To address this challenge, various coupling mechanisms have been exploited using sophisticated coupler designs involving complex light interactions with structures from the microscale to the macroscale. Simulations of these complex interactions are essential for the coupler design. Here, we are introducing a multi-scale simulation workflow to design the coupler making use of the interoperability between Ansys Lumerical and Ansys Zemax OpticStudio.
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