We present a distributed fiber optic sensor that discriminates between temperature and strain along a 500 m fiber with 5 m spatial resolution and a quasi-static temperature (strain) resolution of 15 mK (130 nɛ). The technique relies on a slope-assisted Brillouin system that combines gain and phase information from both the Stokes and anti-Stokes components and a frequency-scanning Rayleigh system that measures the shift in the Rayleigh backscattered spectrum. Uniquely, this hybrid approach enables dynamic measurements with a bandwidth of 1.7 kHz and temperature (strain) noise spectral density of 0.52 mK/√Hz (4.6 nɛ/√Hz), while suppressing cross sensitivity by 25 dB.
A three-color lithographic (3CL) scheme has been developed to achieve high resolution through the use of visible and near IR wavelengths. The intrinsic kinetic properties of 3CL materials are used to optimize the efficiency of deactivation, a crucial step in overcoming background buildup in multipatterning using this technique. To study materials of interest for 3CL, we have developed an in situ technique to monitor exposure and deactivation. A two-beam interference pattern is polymerized on a photoresist and the diffraction of a continuous-wave probe laser is measured in order to identify the polymerization and deactivation thresholds. Here we present preliminary results on the time dependence of the deactivation efficiency of 3CL materials and in situ detection of polymerization thresholds. This is a study of the kinetics for polymerization of 3CL materials to optimize the 3CL scheme to achieve the highest resolution and elucidate its mechanism.
Multicolor photolithography using visible light holds the promise of achieving wafer-scale patterning at pitches on the 10 nm scale. Although substantial progress has been made on multicolor techniques, a number of challenges remain to be met before the ultimate resolution of these methods can be reached. These challenges include the development of improved materials, creation of high-quality thin films, transitioning to exposure schemes that rely completely on linear absorption, scaling up to large-area patterning, and developing methods for effective pattern transfer. This paper discusses the state of the art in multicolor photolithography, presents some of the most recent advances in this field, and examines the prospects moving forward.
Three-color lithography (3CL) can produce high-resolution features using visible light. This technique uses one beam to pre-activate a photoresist, a second beam to deactivate it, and a third beam to activate the pre-activated regions that have not been deactivated. The deactivation beam is used to trim features, allowing for improved feature size and resolution. Although this 3CL was pioneered with 2-photon excitation, the ultimate goal is to use thin films with linear excitation, such that it is compatible with industrial requirements. We will discuss the first thin-film 3CL studies, which are a promising step towards large-area patterning.
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