Mr. Sangil Lim Profile

Sangil Lim

at SAMSUNG Electronics Co Ltd

SPIE Involvement:

Author

Publications (3)

Proceedings Article | 27 April 2023 Presentation + Paper

Massive overlay metrology solution by realizing imaging Mueller matrix spectroscopic ellipsometry

Jaehyeon Son, Juntaek Oh, Eunsoo Hwang, Jinwoo Ahn, Jaewon Lee, Byungkwan Oh, Donggun Lee, Seunga Lim, Kihun Kang, Sangil Im, Jibin Jeong, Taehyun Yun, Jinsoo Lee, Changhyeong Yoon, Hyukjoon Cho, Gangbu Kim, Byeongki Kang, Hankyoul Moon, Jong-hyun Hwang, Youngkyu Park, Taejoong Kim, Suyoung Lee, Yusin Yang, Myungjun Lee

Proceedings Volume 12496, 124960L (2023) https://doi.org/10.1117/12.2657414

KEYWORDS: Overlay metrology, Mueller matrices, Semiconducting wafers, Spectroscopic ellipsometry, Critical dimension metrology, Imaging spectroscopy, Metrology, Polarization, Polysomnography, Image sensors

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Proceedings Article | 27 April 2023 Paper

Wide-field massive CD metrology based on the imaging Mueller-matrix ellipsometry for semiconductor devices

Juntaek Oh, Jaehyeon Son, Eunsoo Hwang, Jinwoo Ahn, Jaewon Lee, Byungkwan Oh, Donggun Lee, Seunga Lim, Kihun Kang, Sangil Im, Jibin Jeong, Taehyun Yun, Jinsoo Lee, Changhyeong Yoon, Hyukjoon Cho, Gangbu Kim, Byeongki Kang, Hankyoul Moon, Jong-hyun Hwang, Youngkyu Park, Taejoong Kim, Suyoung Lee, Yusin Yang, Myungjun Lee

Proceedings Volume 12496, 124962X (2023) https://doi.org/10.1117/12.2658131

KEYWORDS: Critical dimension metrology, Semiconducting wafers, Metrology, Semiconductors, Mueller matrices, Ellipsometry, Inspection

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SPIE Journal Paper | 20 April 2022 Open Access

Toward realization of high-throughput hyperspectral imaging technique for semiconductor device metrology

Changhyeong Yoon, Gwangsik Park, Daehoon Han, Sang-il Im, Sungmin Jo, Jinseob Kim, Wookrae Kim, Changhoon Choi, Myungjun Lee

JM3, Vol. 21, Issue 02, 021209, (April 2022) https://doi.org/10.1117/12.10.1117/1.JMM.21.2.021209

KEYWORDS: Semiconducting wafers, Cameras, Critical dimension metrology, Semiconductors, Spectral resolution, Spatial resolution, Hyperspectral imaging, Imaging systems, Metrology, Wafer-level optics

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