Myungjun Lee is the vice president and the head of the Metrology and Inspection team at Samsung Electronics, where he leads the development of cutting-edge metrology and inspection solutions essential for semiconductor chip manufacturing. Before joining Samsung in 2017, he gained valuable experience working at several prominent companies, including KLA-Tencor, the Strategic Lithography Team at GlobalFoundries (the pathfinding patterning team at IBM) in Albany, NY, as well as at Nanometrics, where he contributed to the development of diverse patterning and metrology solutions. Between 2010 and 2011, he served as a postdoctoral fellow in the Electrical Engineering department at UCLA, working with Prof. Aydogan Ozcan on computational imaging & microscopy techniques.
Dr. Lee earned his Ph.D. degree in electrical computer engineering and optical science from the University of Arizona under the guidance of Prof. Mark A. Neifeld in 2010. He also holds a master's degree from Texas A&M University, earned in 2005 under the mentorship of Prof. Henry F. Taylor, and a bachelor's degree from Korea University, completed in 2002.
Dr. Lee's extensive contributions to the field include authoring and co-authoring more than 70 journal and conference papers and securing over 50 US patents for a range of optical system designs and their applications in optical imaging, sensing, communications, semiconductor patterning, and metrology.
Dr. Lee earned his Ph.D. degree in electrical computer engineering and optical science from the University of Arizona under the guidance of Prof. Mark A. Neifeld in 2010. He also holds a master's degree from Texas A&M University, earned in 2005 under the mentorship of Prof. Henry F. Taylor, and a bachelor's degree from Korea University, completed in 2002.
Dr. Lee's extensive contributions to the field include authoring and co-authoring more than 70 journal and conference papers and securing over 50 US patents for a range of optical system designs and their applications in optical imaging, sensing, communications, semiconductor patterning, and metrology.
Interactive image annotation and AI-assisted segmentation of TEM images for automatic CD measurement
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