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Tomoyuki Takeishi
at Toshiba Corp
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Author
Publications (5)
Proceedings Article | 29 March 2006 Paper
Pattern defect study using cover material film in immersion lithography
Proceedings Volume 6153, 61531Q (2006) https://doi.org/10.1117/12.655505
KEYWORDS: Water, Particles, Silicon, Coating, Inspection, Digital watermarking, Wafer inspection, Immersion lithography, Semiconducting wafers, Wafer testing
Proceedings Article | 4 May 2005 Paper
Influence of the watermark in immersion lithography process
Daisuke Kawamura, Tomoyuki Takeishi, Koutarou Sho, Kentarou Matsunaga, Naofumi Shibata, Kaoru Ozawa, Satoru Shimura, Hideharu Kyoda, Tetsu Kawasaki, Seiki Ishida, Takayuki Toshima, Yasunobu Oonishi, Shinichi Ito
Proceedings Volume 5753, (2005) https://doi.org/10.1117/12.599314
KEYWORDS: Water, Silicon, Coating, Digital watermarking, Scanning electron microscopy, Immersion lithography, Thin film coatings, Photoresist processing, Semiconducting wafers, Liquids
Proceedings Article | 4 May 2005 Paper
A novel post exposure bake technique to improve CD uniformity over product wafers
Tomoyuki Takeishi, K. Hayasaki, Tsuyoshi Shibata
Proceedings Volume 5753, (2005) https://doi.org/10.1117/12.599192
KEYWORDS: Lithography, Silicon, Manufacturing, Control systems, Process control, Photomasks, Critical dimension metrology, Photoresist processing, Semiconducting wafers, Process engineering
Proceedings Article | 12 June 2003 Paper
Novel laser ablation patterning with organic thin film in running water
Shinichi Ito, Hiroshi Ikegami, Kenji Kawano, Tomoyuki Takeishi, Nobuo Hayasaka, Masayoshi Kobayashi, Tetsuya Hamamoto, Yoichi Ogawa, Naoto Yoshitaka, Shoichi Terada
Proceedings Volume 5039, (2003) https://doi.org/10.1117/12.485045
KEYWORDS: Thin films, Lithography, Optical lithography, Cameras, Video, Particles, Laser ablation, Optical alignment, Photoresist processing, Natural surfaces
Proceedings Article | 12 June 2003 Paper
Novel development technique using ozonated water
Kei Hayasaki, Riichiro Takahashi, Tomoyuki Takeishi, Shinichi Ito
Proceedings Volume 5039, (2003) https://doi.org/10.1117/12.485068
KEYWORDS: Particles, Inspection, Optical testing, Scanning electron microscopy, Critical dimension metrology, Photoresist processing, Semiconducting wafers, Natural surfaces, Process engineering, Defect inspection
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