Mr. Omri Baum Profile

Omri Baum

at Applied Materials Israel Ltd

SPIE Involvement:

Author

Publications (4)

SPIE Journal Paper | 4 November 2022

Process window improvement for fin cut layer in self-aligned double-patterning process based on backscattered electron imaging

Yu Zhang, David Wei Zhang, Yuyang Bian, Biqiu Liu, Cong Zhang, Jun Huang, Jiawang Song, Yang Gao, Qiang Zhou, Wei Chen, Siqun Xiao, Shmuel Ben Nissim, Kevin Houchens, Omri Baum, Amit Zakay, Tal Ayzik, Yaniv Abramovitz

JM3, Vol. 21, Issue 04, 041605, (November 2022) https://doi.org/10.1117/12.10.1117/1.JMM.21.4.041605

KEYWORDS: Etching, System on a chip, Image processing, Sensors, Lithography, Semiconducting wafers, Distance measurement, Process control, Transistors, Signal to noise ratio

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Proceedings Article | 13 June 2022 Presentation

A holistic study of edge placement error on fin cut layer in self-aligned double patterning process

Yuyang Bian, Biqiu Liu, Xijun Guan, Xiaobo Guo, Cong Zhang, Wenzhan Zhou, Jun Huang, Yu Zhang, Jiawang Song, Yang Gao, Shmuel Nissim, Kevin Houchens, Omri Baum, Qiang Zhou, Zaisan Yang, Amit Zakay, Tal Ayzik, Yaniv Abramovitz

Proceedings Volume PC12053, PC120530D (2022) https://doi.org/10.1117/12.2614221

KEYWORDS: Overlay metrology, Double patterning technology, Edge roughness, Scanning electron microscopy, Manufacturing, Line width roughness, Line edge roughness, Integrated circuits, Electron microscopy, Critical dimension metrology

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Proceedings Article | 19 August 2021 Presentation + Paper

The importance of in-die sampling using E-beam solution on yield improvement

Yu Zhang, Biqiu Liu, Cong Zhang, Yuyang Bian, Song Gao, Yifei Zhu, Xiaobo Guo, Jun Huang, Yaniv Abramovitz, Qiang Zhou, Uri Smolyan, Omri Baum, Shmuel Ben Nissim, Alexander Vipolzov

Proceedings Volume 11611, 116111X (2021) https://doi.org/10.1117/12.2585391

KEYWORDS: Overlay metrology, Instrument modeling, Semiconducting wafers, Measurement devices, Wafer-level optics, Mathematical modeling, Yield improvement, Etching, Optical testing, Data modeling

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Proceedings Article | 7 May 2019 Presentation + Paper

SEM inspection and review method for addressing EUV stochastic defects

Tal Itzkovich, Aner Avakrat, Shimon Levi, Omri Baum, Noam Amit, Kevin Houchens

Proceedings Volume 10959, 109591S (2019) https://doi.org/10.1117/12.2514877

KEYWORDS: Stochastic processes, Metrology, Inspection, Scanning electron microscopy, Critical dimension metrology, Extreme ultraviolet, Error analysis, Defect inspection, Defect detection, Lithography

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